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The ornamental design for an IC recorder, as shown.
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FIG. 1 is a perspective view of an IC recorder showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof; and,
FIG. 5 is a bottom plan view thereof.
Portions in broken lines are for illustrative purposes only and form no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 30 2003 | TANAKA, SOICHI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013961 | /0321 | |
Feb 25 2003 | Sony Corporation | (assignment on the face of the patent) | / |
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