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The ornamental design for a mobile phone end device, as shown and described.
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FIG. 1 is a front elevational view of a mobile phone end device of the claimed design.
FIG. 2 is a rear elevational view of the mobile phone end device of FIG. 1.
FIG. 3 is a top view of the mobile phone end device of FIG. 1.
FIG. 4 is a bottom view of the mobile phone end device of FIG. 1.
FIG. 5 is a right side view the mobile phone end device of FIG. 1.
FIG. 6 is a left side view of the mobile phone end device of FIG. 1; and,
FIG. 7 is a perspective view of the mobile phone end device of FIG. 1.
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Jan 07 2003 | Siemens Aktiengesellschaft | (assignment on the face of the patent) | / | |||
Feb 24 2003 | LUDWIG, JORN | Siemens Aktiengesellschaft | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013946 | /0935 | |
Mar 23 2006 | Siemens Aktiengesellschaft | BENQ MOBILE GMBH & CO OHG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017732 | /0681 | |
Jul 01 2007 | BENQ MOBILE GMBH & CO OHG | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 019897 | /0912 | |
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Apr 30 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030341 | /0459 | |
Dec 18 2013 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Palm, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0544 | |
Dec 18 2013 | Palm, Inc | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031837 | /0239 | |
Jan 23 2014 | Hewlett-Packard Company | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 | |
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Jan 23 2014 | Palm, Inc | Qualcomm Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032177 | /0210 |
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