Electronics component package element

Abstract

Description

FIG. 1 is a side elevation view of a first embodiment of an electronics component package, showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevation view thereof;

FIG. 5 is a side elevation view of a second embodiment of an electronics component package, showing our new design;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a front plan view thereof.

Claims

The ornamental design of an electronics components package element, as shown and described herein.