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			   The ornamental design for an interphone, as shown and described.     
    
    
    
    
    
    
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FIG. 1 is a perspective view of the interphone showing our new design;
FIG. 2 is a front elevational view of the interphone of FIG. 1;
FIG. 3 is a left side elevational view of the interphone of FIG. 1;
FIG. 4 is a right side elevational view of the interphone of FIG. 1;
FIG. 5 is a rear elevational view of the interphone of FIG. 1;
FIG. 6 is a top plan view of the interphone of FIG. 1; and,
FIG. 7 a bottom plan view of the interphone of FIG. 1.
Hotta, Toshio, Yamaguchi, Hidenori
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc | 
| Feb 25 2003 | YAMAGUCHI, HIDENORI | AIPHONE CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013847 | /0188 | |
| Feb 25 2003 | HOTTA, TOSHIO | AIPHONE CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013847 | /0188 | |
| Mar 06 2003 | Aiphone Co., Ltd. | (assignment on the face of the patent) | / | 
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