Patent
   D490785
Priority
Apr 11 2002
Filed
Apr 11 2002
Issued
Jun 01 2004
Expiry
Jun 01 2018
Assg.orig
Entity
unknown
5
10
n/a
The ornamental design for a converter, as shown and described.

FIG. 1 is a perspective view of the converter of the present invention;

FIG. 2 is a front view of the converter of the present invention;

FIG. 3 is a back view of the converter of the present invention;

FIG. 4 is a left side view of the converter of the present invention;

FIG. 5 is a right side view of the converter of the present invention;

FIG. 6 is a top view of the converter of the present invention; and,

FIG. 7 is a bottom view of the converter of the present invention.

The components shown with broken lines do not make up a part of the claimed design.

Boylan, Jeffrey John, Lee, Victor Ke-Ji, Kidwell, Gary Robert, Fellows, Timothy Richard, Heinrich, Randy Thomas

Patent Priority Assignee Title
D606017, Aug 21 2006 Siemens Aktiengesellschaft Convection cooled frequency converter
D641696, Aug 21 2006 Siemens Aktiengesellschaft Convection cooled frequency converter
D641697, Aug 21 2006 Siemens Aktiengesellschaft Convection cooled frequency converter
D873225, Dec 06 2017 Omron Corporation Heatsink
D923591, Mar 15 2019 TAMURA CORPORATION Semiconductor driving circuit module
Patent Priority Assignee Title
4254301, Mar 19 1979 Xerox Corporation Printed circuit board component mounting support and spacer
4362904, Jan 18 1982 Reliance Electric Company Printed circuit board component mounting support and spacer
5150282, Dec 14 1990 Fujitsu Limited Electromagnetic shielding structure of high-frequency circuit arrangements
5303123, Dec 21 1992 Alcatel Network Systems, Inc. Retainer for removable circuit board components
6189203, Apr 08 1999 ABB POWER ELECTRONICS INC Method of manufacturing a surface mountable power supply module
6191954, Nov 16 1998 International Business Machines Corporation Controlled low impedance high current circuit board interconnect
6208516, May 11 1999 Apple Inc Electromagnetic interference shield and gap filler for a circuit board
6232562, Sep 30 1998 Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD Hybrid integrated circuit device
D412887, Apr 27 1995 Cycle Computer Corporation Scalable processing architecture (SPARC) computer motherboard
D465199, Mar 22 2002 TDK-Lambda Corporation Power supply
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 10 2002LEE, VICTOR KE-JIInnoveta TechnologiesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128050281 pdf
Apr 10 2002KIDWELL, GARY ROBERTInnoveta TechnologiesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128050281 pdf
Apr 10 2002HEINRICH, RANDY THOMASInnoveta TechnologiesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128050281 pdf
Apr 10 2002FELLOWS, TIMOTHY RICHARDInnoveta TechnologiesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128050281 pdf
Apr 10 2002BOLYLAN, JEFFREY JOHNInnoveta TechnologiesASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128050281 pdf
Apr 11 2002Innoveta Technologies(assignment on the face of the patent)
Mar 03 2003INNOVETA TECHNOLOGIES, INC TDK INNOVETA INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0148300891 pdf
Sep 30 2008TDK INNOVETA INC DENSEI LAMBDA K K ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0226100475 pdf
Sep 30 2008TDK INNOVETA INC DENSEI-LAMBDA K K CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION FOR TDK INNOVETA INC FROM TEXAS TO DELAWARE PREVIOUSLY RECORDED ON REEL 022610 FRAME 0475 ASSIGNOR S HEREBY CONFIRMS THE STATE IN WHICH TDK INNOVETA INC WAS INCORPORATED WAS DELAWARE, NOT TEXAS 0298250743 pdf
Oct 01 2008DENSEI-LAMBDA K K TDK-Lambda CorporationCHANGE OF NAME SEE DOCUMENT FOR DETAILS 0297770411 pdf
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