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The ornamental design for an interphone, as shown and described.
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FIG. 1 is a perspective view of an interphone showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a perspective view illustrating a second embodiment of the present invention;
FIG. 9 is a front elevational view thereof;
FIG. 10 is a rear elevational view thereof
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a top plan view thereof; and,
FIG. 14 is a bottom plan view thereof.
Matsui, Hiroshi, Hotta, Toshio
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 02 2003 | Aiphone Co., Ltd. | (assignment on the face of the patent) | / | |||
Feb 04 2003 | MATSUI, HIROSHI | AIPHONE CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013908 | /0794 | |
Feb 06 2003 | HOTTA, TOSHIO | AIPHONE CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013908 | /0794 |
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