Patent
   D492267
Priority
Mar 26 2003
Filed
Sep 25 2003
Issued
Jun 29 2004
Expiry
Jun 29 2018
Assg.orig
Entity
unknown
14
15
n/a
The ornamental design for a composite electronic component, as shown and described.

FIG. 1 is a perspective view of the front, bottom and left side of a composite electronic component showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

Koga, Eiichi, Kawajiri, Keiji, Okimoto, Tomohisa

Patent Priority Assignee Title
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7608919, Sep 04 2003 University of Notre Dame du Lac Interconnect packaging systems
7612443, Sep 04 2003 University of Notre Dame du Lac Inter-chip communication
8021965, Sep 04 2003 University of Notre Dame du Lac Inter-chip communication
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9620473, Jan 18 2013 Indiana Integrated Circuits, LLC Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
D522451, Apr 14 2005 Microsoft Corporation Housing for a battery
D544832, Oct 27 2003 HMD Global Oy Portion of a battery
D546276, Nov 12 2003 HMD Global Oy Portion of a battery
D584733, Aug 23 2007 Dell Products L.P.; Dell Products L P Storage device enclosure
D590337, Jan 23 2008 Sony Corporation Rechargeable battery
D618171, Jan 23 2008 Sony Corporation Rechargeable battery
D676851, Mar 16 2012 Tablet style computer handle
D845235, Oct 25 2017 CHUWI INNOVATION AND TECHNOLOGY (SHENZHEN) CO., LTD. Charger
Patent Priority Assignee Title
5034709, Nov 17 1988 Murata Manufacturing Co., Ltd. Composite electronic component
5493769, Aug 05 1993 Murata Manufacturing Co., Ltd. Method of manufacturing electronic component and measuring characteristics of same
5644107, Jul 27 1992 Murata Manufacturing Co., Ltd. Method of manufacturing a multilayer electronic component
6380619, Mar 31 1998 TDK Corporation Chip-type electronic component having external electrodes that are spaced at predetermined distances from side surfaces of a ceramic substrate
6392297, Mar 29 1996 NEC Tokin Corporation Electronic circuit element of conductor/insulator stacked type using high machinability substrate and benzocyclobutene as insulator
6525395, Oct 19 1999 MURATA MANUFACTURING CO , LTD Chip-type composite electronic component and manufacturing method thereof
6700061, Oct 17 2000 MURATA MANUFACTURING CO , LTD Composite electronic component
D298031, Apr 19 1985 TAYLOR, MICHELE; ROUVEYROL,CARRIE S ; Channell Commercial Corporation Housing for electronic equipment for cable television installation
D349687, Apr 13 1990 Motorola, Inc. Radio frequency switch box
JP1076502D,
JP1081918D,
JP1109035D,
JP9292611D,
JP9292612D,
JP929261D,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 25 2003Matsushita Electric Industrial Co., Ltd.(assignment on the face of the patent)
Oct 02 2003KAWAJIRI, KEIJIMATSUSHITA ELECTRIC INDUSTRIAL CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0147910756 pdf
Oct 02 2003OKIMOTO, TOMOHISAMATSUSHITA ELECTRIC INDUSTRIAL CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0147910756 pdf
Oct 02 2003KOGA, EIICHIMATSUSHITA ELECTRIC INDUSTRIAL CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0147910756 pdf
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