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The ornamental design for a remote device, as shown and described.
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FIG. 1 is a perspective view of the remote device;
FIG. 2 is a top plan view;
FIG. 3 is a bottom plan view;
FIG. 4 is a left side elevational view, the right side being a mirror image thereof;
FIG. 5 is a front end view;
FIG. 6 is a rear end view;
FIG. 7 is a perspective view of a second embodiment of the present invention, the stippling in the second embodiment in FIGS. 7-11 is provided to indicate a contrast in surface appearance;
FIG. 8 is a top plan view of the second embodiment shown in FIG. 7, the rear view being the same as in FIG. 3;
FIG. 9 is a left side elevational view of the second embodiment shown in FIG. 7, the right side being a mirror image thereof;
FIG. 10 is a front elevational view of the second embodiment shown in FIG. 7; and,
FIG. 11 is a rear elevational view of the second embodiment shown in FIG. 7.
The broken lines are for illustrative purposes only and form no part of the claimed design.
Tickle, James Dexter, Sanchez, Carlos Solis, Murtaugh, John Patrick, Redenbaugh, Ryan David, Patton, Douglas Mark, Bair, Patrick Harold
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 29 2003 | Interlink Electronics, Inc. | (assignment on the face of the patent) | / | |||
Sep 09 2003 | MURTAUGH, JOHN PATRICK | INTERLINK ELECTRONICS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014096 | /0868 | |
Sep 09 2003 | REDENBAUGH, RYAN DAVID | INTERLINK ELECTRONICS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014096 | /0868 | |
Sep 09 2003 | PATTON, DOUGLAS MARK | INTERLINK ELECTRONICS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014096 | /0868 | |
Oct 17 2003 | SANCHEZ, CARLOS SOLIS | INTERLINK ELECTRONICS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014096 | /0868 | |
Oct 17 2003 | BAIR, PATRICK HAROLD | INTERLINK ELECTRONICS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014096 | /0868 | |
Oct 17 2003 | TICKLE, JAMES DEXTER | INTERLINK ELECTRONICS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014096 | /0868 | |
Dec 19 2006 | INTERLINK ELECTRONICS, INC | Silicon Valley Bank | SECURITY AGREEMENT | 020143 | /0271 | |
Aug 31 2007 | INTERLINK ELECTRONICS, INC | SMK-LINK ELECTRONICS CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 020309 | /0183 | |
Apr 23 2008 | Silicon Valley Bank | INTERLINK ELECTRONICS INC | PARTIAL RELEASE | 020859 | /0939 |
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