Patent
   D493873
Priority
May 24 2002
Filed
Nov 21 2002
Issued
Aug 03 2004
Expiry
Aug 03 2018
Assg.orig
Entity
unknown
20
3
n/a
I claim the ornamental design for heating gas supplier for semiconductor manufacturing equipment, as shown and described.

This article is transparent. This article is used in semiconductor manufacturing equipment. A heating gas is supplied to the rear face of a semiconductor wafer in order to drive heat exchange between a lower electrode and the rear face of the semiconductor wafer. This article is installed in a tube for supplying the heating gas. In the front view drawing, the spiral forms three two-cavity ducts. The spiral ducts act as gas passages in order to prevent an abnormal discharge. The outer diameter of this article is between about 25 mm and 10 mm and the height is between about 60 mm and 70 mm. This article is made of quartz. Other embodiments (not shown) are translucent or opaque in whole or part and/or may be made of other materials.

FIG. 1 is a top/front perspective view of a first embodiment of a heating gas supplier for semiconductor manufacturing equipment;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a sectional view taken along the line 8--8 in FIG. 6;

FIG. 9 is a top/front perspective view of a second embodiment of the heating gas supplier for semiconductor manufacturing equipment;

FIG. 10 is a front elevational view thereof, the rear elevational view being a mirror image thereof and, therefore, not shown;

FIG. 11 is a right side elevational view thereof, the left side elevational view being a mirror image thereof and, therefore, not shown;

FIG. 12 is a top plan view thereof;

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a sectional view taken along the line 14--14 in FIG. 12.

Hayashi, Daisuke

Patent Priority Assignee Title
10262834, Oct 13 2009 Lam Research Corporation Edge-clamped and mechanically fastened inner electrode of showerhead electrode assembly
8161906, Jul 07 2008 Lam Research Corporation Clamped showerhead electrode assembly
8206506, Jul 07 2008 Lam Research Corporation Showerhead electrode
8221582, Jul 07 2008 Lam Research Corporation Clamped monolithic showerhead electrode
8272346, Apr 10 2009 Lam Research Corporation Gasket with positioning feature for clamped monolithic showerhead electrode
8313805, Jul 07 2008 Lam Research Corporation Clamped showerhead electrode assembly
8402918, Apr 07 2009 Lam Research Corporation Showerhead electrode with centering feature
8414719, Jul 07 2008 Lam Research Corporation Clamped monolithic showerhead electrode
8419959, Sep 18 2009 Lam Research Corporation Clamped monolithic showerhead electrode
8536071, Apr 10 2009 Lam Research Corporation Gasket with positioning feature for clamped monolithic showerhead electrode
8573152, Sep 03 2010 Lam Research Corporation Showerhead electrode
8796153, Jul 07 2008 Lam Research Corporation Clamped monolithic showerhead electrode
9245716, Oct 13 2009 Lam Research Corporation Edge-clamped and mechanically fastened inner electrode of showerhead electrode assembly
D686710, Aug 16 2011 Heat storage
D686711, Aug 16 2011 Heat storage
D686712, Aug 16 2011 Heat storage
D810266, Jun 17 2016 Puzhen Life Co., Limited Aroma diffuser
D818961, Feb 10 2016 KOKUSAI ELECTRIC CORPORATION Insulation unit cover of semiconductor manufacturing apparatus
D855787, Mar 20 2018 IRIS OHYAMA INC. Air circulator
D953499, Jul 30 2020 CANADIAN TIRE CORPORATION, LIMITED Outdoor space heater
Patent Priority Assignee Title
6277201, Apr 30 1998 ASM Japan K.K. CVD apparatus for forming thin films using liquid reaction material
6412501, Jun 29 1999 Kimmon Quartz Co., Ltd. Drying apparatus and drying method
6635307, Dec 12 2001 Nanotek Instruments Group, LLC Manufacturing method for thin-film solar cells
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 21 2002Tokyo Electron Limited(assignment on the face of the patent)
Jan 21 2003HAYASHI, DAISUKETokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0137660497 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule