Patent
   D494146
Priority
Jul 29 2003
Filed
Jul 29 2003
Issued
Aug 10 2004
Expiry
Aug 10 2018
Assg.orig
Entity
unknown
4
7
n/a
The ornamental design for seat of heating radiator, as shown and described.

FIG. 1 is a perspective view of a seat of a heating radiator showing this new design;

FIG. 2 is a right side elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 is a rear elevational view thereof.

Lin, Chi-Hsu

Patent Priority Assignee Title
D929951, May 21 2018 ABKO CO., Ltd. Cooling fan for electronic devices
ER2873,
ER5136,
ER97,
Patent Priority Assignee Title
5484013, May 27 1993 Nippon Densan Corporation Heat sink fan
5582506, Mar 06 1995 SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO , LTD Fan assembly for an integrated circuit
6199624, Apr 30 1999 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
6587341, Mar 04 2002 Chun Long Metal Co., Ltd. Heat dissipater structure
6625021, Jul 22 2002 Intel Corporation Heat sink with heat pipes and fan
6672374, Oct 23 2002 Heat sink coupling device
D478875, Nov 05 2001 Zalman Tech Co., Ltd. Duct and housing unit for a heat sink for electronic equipment
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 09 2003LIN, CHI-HSULI, NIEN-LUNASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0143420409 pdf
Jul 29 2003Datech Technology Co., Ltd.(assignment on the face of the patent)
May 30 2004LI, NIEN-LUNDATECH TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0154900644 pdf
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