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The ornamental design for a computer housing, as shown and described.
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FIG. 1 is a top, front and right side perspective view of a computer housing showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is bottom plan view thereof; and,
FIG. 8 is a top, front and left side perspective view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 17 2003 | LIN, PEI-SHI | THERMAL TAKE TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014543 | /0883 | |
Sep 24 2003 | Thermaltake Technology Co., Ltd. | (assignment on the face of the patent) | / |
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