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We claim the ornamental design for a printed circuit board daughter board support, as shown and described.
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FIG. 1 is a side elevational perspective view of a printed circuit board daughter board support;
FIG. 2 is a front elevational view of a printed circuit board daughter board support;
FIG. 3 is a rear elevational view of a printed circuit board daughter board support;
FIG. 4 is a side elevational view of one side of a printed circuit board daughter board support;
FIG. 5 is a side elevational view of the opposite side of a printed circuit board daughter board support;
FIG. 6 is a top view of a printed circuit board daughter board support; and,
FIG. 7 is a bottom view of a of a printed circuit board daughter board support.
Wing, Kenneth E., Carroll, Scott T., Nguyen, Khoi V.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 03 2004 | Hitek Power Corp. | (assignment on the face of the patent) | / | |||
| Apr 22 2004 | CARROLL, SCOTT T | HITEK POWER CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015281 | /0350 | |
| Apr 22 2004 | WING, KENNETH E | HITEK POWER CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015281 | /0350 | |
| Apr 22 2004 | NGUYEN, KHOI V | HITEK POWER CORPORATION | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015281 | /0350 | |
| Nov 05 2007 | LHV POWER CORP | LHV POWER CORP | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 025749 | /0479 | |
| Dec 19 2016 | LHV Power Corporation | CURRENT WAYS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 040680 | /0056 |
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