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The ornamental design for compact disk, as shown.
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FIG. 1 is a perspective view of the ornamental design of the present invention;
FIG. 2 is a front elevational view of the ornamental design of the present invention;
FIG. 3 is a rear elevational view of the ornamental design of the present invention;
FIG. 4 is a left side elevational view of the ornamental design of the present invention;
FIG. 5 is a right side elevational view of the ornamental design of the present invention;
FIG. 6 is a top plan view of the ornamental design of the present invention;
FIG. 7 is a bottom view of the ornamental design of the present invention; and,
FIG. 8 is a perspective view of the ornamental design of the present invention with the disk in the open position.
Bang, Yong-Seok, Yeo, Young-Ju, Bae, Seong-kyoon, You, Ji-hyun
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Sep 29 2003 | BANG, YONG-SEOK | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014729 | /0264 | |
| Sep 29 2003 | BAE, SEONG-KYOON | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014729 | /0264 | |
| Sep 29 2003 | YEO, YOUN-JU | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014729 | /0264 | |
| Sep 29 2003 | YOU, JI-HYUN | SAMSUNG ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014729 | /0264 | |
| Nov 17 2003 | Samsung Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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