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We claim the ornamental design for a housing for electronic device, as shown and described.
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FIG. 1 is a side elevation of a housing for electronic device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevation of the side opposite that shown in FIG. 1;
FIG. 4 is an end elevation thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is an end elevation of the end opposite that shown in FIG. 4; and,
FIG. 7 is a perspective view thereof.
Portions of each of the figure drawing are stippled to indicate a contrast in surface finish.
Jung, Richard K., Puckett, Joie L.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 18 2002 | JUNG, RICHARD K | D-LINK SYSTEMS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014355 | /0078 | |
Sep 18 2002 | PUCKETT, JOIE L | D-LINK SYSTEMS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014355 | /0078 |
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Date | Maintenance Schedule |