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The ornamental design for a electronics housing, as shown and described.
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FIG. 1 is a perspective view of the electronics housing;
FIG. 2 is a perspective view of the electronics housing of FIG. 1 and shown in open position;
FIG. 3 is a bottom end view;
FIG. 4 is a front view;
FIG. 5 is a rear view;
FIG. 6 is a right side view and a mirror image of a left side view; and,
FIG. 7 is a top end view.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 15 2003 | MAH, PAT Y | DAKA DEVELOPMENT LTD HONG KONG CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014875 | /0203 | |
Jan 02 2004 | Daka Development Ltd. | (assignment on the face of the patent) | / |
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