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The ornamental design for a housing for electronic devices, as shown.
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FIG. 1 is a photograph from a perspective showing the top, end, and side of a housing embodying the ornamental design of the present invention.
FIG. 2 is a photograph from a perspective showing the top, end, and side of the housing shown in FIG. 1.
FIG. 3 is a photograph from a perspective showing the bottom, end, and side of the housing shown in FIG. 1.
FIG. 4 is a photograph from a perspective showing the top, end, and side of a second form of housing embodying the ornamental design of the present invention.
FIG. 5 is a photograph from a perspective showing the top, end, and side of the housing shown in FIG. 4; and,
FIG. 6 is a photograph from a perspective showing the bottom, end, and side of the housing shown in FIG. 4.
Nussberger, Martin, Herrlich, Oliver
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 13 2002 | Odenwalder Kunststoffwerke Gehausesysteme GmbH | (assignment on the face of the patent) | / | |||
| Jun 28 2003 | NUSSBERGER, MARTIN | Odenwalder Kunststoffwerke Gehausesysteme GmbH | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013805 | /0812 | |
| Jun 28 2003 | HERRLICH, OLIVER | Odenwalder Kunststoffwerke Gehausesysteme GmbH | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013805 | /0812 |
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