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The ornamental design for an earphone wire adjusting device, as shown and described.
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FIG. 1 is a perspective view thereof;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof
FIG. 8 is a perspective view in use state thereof; and,
FIG. 9 is also a perspective view in use state thereof.
The broken line showing in FIGS. 8 and 9 is for illustrative purposes only and forms no part of the claimed design.
Ko, Ti-Chieh, Sim, Mong-Yong, Chen, Jen-Feng, Wang, Chien-Jui
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 11 2004 | KO, TI-CHIEH | Benq Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015120 | /0164 | |
Mar 11 2004 | SIM, MONG-YONG | Benq Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015120 | /0164 | |
Mar 11 2004 | CHEN, JEN-FENG | Benq Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015120 | /0164 | |
Mar 11 2004 | WANG, CHIEN-JUI | Benq Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015120 | /0164 | |
Mar 18 2004 | Benq Corporation | (assignment on the face of the patent) | / |
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