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The ornamental design for a computer mainframe front panel, as shown and described.
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FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a top, front and left side perspective view thereof, shown with the fronts in an open position; and,
FIG. 9 is a top, front and right side perspective view thereof, shown with the fronts in an open position.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 25 2004 | LIN, PEI-SHI | THERMALTAKE TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015406 | /0650 | |
May 28 2004 | Thermaltake Technology Co., Ltd. | (assignment on the face of the patent) | / |
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