Patent
   D505675
Priority
Sep 12 2003
Filed
Sep 12 2003
Issued
May 31 2005
Expiry
May 31 2019
Assg.orig
Entity
unknown
6
7
n/a
The ornamental design for an external enclosure, as shown and described.

FIG. 1 is a perspective view of an external enclosure;

FIG. 2 is a front elevation thereof;

FIG. 3 is a rear elevation thereof;

FIG. 4 is a left side elevation thereof;

FIG. 5 is a right side elevation thereof;

FIG. 6 is a top plane view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.

Chen, Yi-Hung

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Patent Priority Assignee Title
5317462, Oct 18 1991 International Business Machines Corporation Cover seal for magnetic disk enclosure having stepped mating surfaces
D374222, Oct 25 1995 Multi-Tech Systems, Inc. Case for data/voice/fax concentrator
D400512, Feb 12 1997 Fibox Oy AB Enclosure for electronic and electric components
D419966, Feb 19 1998 SIEMENS INDUSTRY, INC Weatherproof enclosure
D472547, Feb 27 2002 ALLIED TELESIS HOLDINGS K K Modem
D483725, Apr 19 2002 Viavi Solutions Inc Modular housing for electronic and optical components
D485830, Jan 09 2003 Cameo Communications Inc Network system coupling case
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Aug 13 2003CHEN, YI-HUNGA-TEC SUBSYSTEM INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0144970153 pdf
Sep 12 2003A-Tec Subsystem Inc.(assignment on the face of the patent)
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