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The ornamental design for a rigid support for a thin film data storage medium, as shown and described.
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FIG. 1 is a top perspective view of a rigid support for a thin film data storage medium showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a top plan view of a second embodiment thereof;
FIG. 4 is a top plan view of a third embodiment thereof;
FIG. 5 is a top plan view of a fourth embodiment thereof;
FIG. 6 is a bottom plan view of the design of FIG. 1;
FIG. 7 is a side elevation view thereof, as seen towards line 2—2, the opposite side is a mirror image; and,
FIG. 8 is a front elevation view thereof, as seen towards line 1—1, the rear view is a mirror image.
Boissonneault, Ronald A., Pisipati, Ramesh M.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 07 2004 | BOISSONNEAULT, RONALD A | Bayer Polymers LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015218 | /0896 | |
Apr 07 2004 | PISIPATI, RAMESH M | Bayer Polymers LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015218 | /0896 | |
Apr 08 2004 | Bayer MaterialScience LLC | (assignment on the face of the patent) | / | |||
Apr 22 2004 | Bayer Polymers LLC | Bayer MaterialScience LLC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 036388 | /0892 | |
Sep 01 2015 | Bayer MaterialScience LLC | Covestro LLC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 036876 | /0585 |
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