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The ornamental design for a veta power converter, as shown and described.
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FIG. 1 is a perspective view of the veta power converter of the present invention;
FIG. 2 is a right side view of the veta power converter of the present invention;
FIG. 3 is a left side view of the veta power converter of the present invention;
FIG. 4 is a front view of the veta power converter of the present invention;
FIG. 5 is a back view of the veta power converter of the present invention;
FIG. 6 is a top view of the veta power converter of the present invention;
FIG. 7 is a perspective view of the veta power converter of the present invention providing a space to insert a bead to provide extra filtering to reduce signal ripple and noise;
FIG. 8 is a right side view of the veta power converter of the present invention providing a space to insert a bead to provide extra filtering to reduce signal ripple and noise; and,
FIG. 9 is a bottom view of the veta power converter of the present invention.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
Chen, Qing, Hilburn, Del Ray, Lee, Victor Ke-Ji, Heinrich, Randy Thomas
| Patent | Priority | Assignee | Title |
| Patent | Priority | Assignee | Title |
| 4254301, | Mar 19 1979 | Xerox Corporation | Printed circuit board component mounting support and spacer |
| 4362904, | Jan 18 1982 | Reliance Electric Company | Printed circuit board component mounting support and spacer |
| 5150282, | Dec 14 1990 | Fujitsu Limited | Electromagnetic shielding structure of high-frequency circuit arrangements |
| 5303123, | Dec 21 1992 | Alcatel Network Systems, Inc. | Retainer for removable circuit board components |
| 6189203, | Apr 08 1999 | ABB POWER ELECTRONICS INC | Method of manufacturing a surface mountable power supply module |
| 6191954, | Nov 16 1998 | International Business Machines Corporation | Controlled low impedance high current circuit board interconnect |
| 6208516, | May 11 1999 | Apple Inc | Electromagnetic interference shield and gap filler for a circuit board |
| 6232562, | Sep 30 1998 | Taiyo Yuden Co., Ltd.; TAIYO YUDEN CO , LTD | Hybrid integrated circuit device |
| D412887, | Apr 27 1995 | Cycle Computer Corporation | Scalable processing architecture (SPARC) computer motherboard |
| D465199, | Mar 22 2002 | TDK-Lambda Corporation | Power supply |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Apr 08 2002 | CHEN, QING | Innoveta Technologies | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013020 | /0563 | |
| Apr 08 2002 | HEINRICH, RANDY THOMAS | Innoveta Technologies | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013020 | /0563 | |
| Apr 08 2002 | HILBURN, DEL RAY | Innoveta Technologies | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013020 | /0563 | |
| Apr 08 2002 | LEE, VICTOR KE-JI | Innoveta Technologies | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013020 | /0563 | |
| Jun 17 2002 | TDK Innoveta Inc. | (assignment on the face of the patent) | / | |||
| Mar 03 2003 | INNOVETA TECHNOLOGIES, INC | TDK INNOVETA INC | MERGER SEE DOCUMENT FOR DETAILS | 014835 | /0349 | |
| Sep 30 2008 | TDK INNOVETA INC | DENSEI-LAMBDA K K | CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION FOR TDK INNOVETA INC FROM TEXAS TO DELAWARE PREVIOUSLY RECORDED ON REEL 022610 FRAME 0475 ASSIGNOR S HEREBY CONFIRMS THE STATE IN WHICH TDK INNOVETA INC WAS INCORPORATED WAS DELAWARE, NOT TEXAS | 029825 | /0743 | |
| Sep 30 2008 | TDK INNOVETA INC | DENSEI LAMBDA K K | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022610 | /0475 | |
| Oct 01 2008 | DENSEI-LAMBDA K K | TDK-Lambda Corporation | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 029777 | /0411 |
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