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We claim the ornamental design for a chip and light emitting diode panel housing, as shown and described.
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FIG. 1 is a perspective view of a chip and light emitting diode panel housing in accordance with the design;
FIG. 2 is a front view of the housing of FIG. 1;
FIG. 3 is a back view of the housing of FIG. 1;
FIG. 4 is a left view of the housing of FIG. 1;
FIG. 5 is a right view of the housing of FIG. 1;
FIG. 6 is a top view of the housing of FIG. 1; and,
FIG. 7 is a bottom view of the housing of FIG. 1.
Phipps, Michael, Southgate, Timothy J.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Sep 10 2004 | Altera Corporation | (assignment on the face of the patent) | / |
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