Patent
   D509195
Priority
Apr 08 2003
Filed
Apr 08 2003
Issued
Sep 06 2005
Expiry
Sep 06 2019
Assg.orig
Entity
unknown
1
8
n/a
The ornamental design for a light emitting diode package, as shown and described.

A light emitting diode (LED) with two top electrodes is mounted on a first metal plate. One of the electrodes is wire-bonded to the first metal plate serving as one terminal of the LED. The other electrode of the LED is connected by wire-bonding to a second metal plate serving as a second terminal of the LED. The inner ends of the metal plates and the LED are imbedded in a transparent glue, leaving the outer ends of the metal plates for external connection. The transparent glue allows the light emitted from the LED to be radiated.

FIG. 1 is a top plan view of the light emitting diode package showing our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof; and,

FIG. 5 is a side elevation view thereof.

Wang, Bily, Chuang, Jonnie, Lee, Yann

Patent Priority Assignee Title
D562272, Nov 17 2006 Lighthouse Technology Co., Ltd. Light emitting diode (LED)
Patent Priority Assignee Title
5969416, Sep 19 1997 Samsung Aerospace Industries, Ltd. Ball grid array semiconductor package
6268652, Sep 26 1997 NEC Electronics Corporation CSP type semiconductor device with reduced package size
6495861, Mar 18 1999 Ròhm Co., Ltd. Light-emitting semiconductor chip
6717256, Aug 31 1998 Rohm Co., Ltd. Mounting structure for semiconductor device having entirely flat leads
6777719, Mar 19 1999 Rohm Co., Ltd. Chip light-emitting device
20040075100,
20040188697,
D476961, Apr 12 2002 CITIZEN ELECTRONICS CO , LTD Light-emitting diode
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 27 2003WANG, BILYHARVATEK CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0139510656 pdf
Feb 27 2003CHUANG, JONNIEHARVATEK CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0139510656 pdf
Feb 27 2003LEE, YANNHARVATEK CORP ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0139510656 pdf
Apr 08 2003Harvatek Corporation(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule