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The ornamental design for a light emitting diode package, as shown and described.
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A light emitting diode (LED) with two top electrodes is mounted on a first metal plate. One of the electrodes is wire-bonded to the first metal plate serving as one terminal of the LED. The other electrode of the LED is connected by wire-bonding to a second metal plate serving as a second terminal of the LED. The inner ends of the metal plates and the LED are imbedded in a transparent glue, leaving the outer ends of the metal plates for external connection. The transparent glue allows the light emitted from the LED to be radiated.
FIG. 1 is a top plan view of the light emitting diode package showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a right side elevation view thereof; and,
FIG. 5 is a side elevation view thereof.
Wang, Bily, Chuang, Jonnie, Lee, Yann
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 27 2003 | WANG, BILY | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013951 | /0656 | |
| Feb 27 2003 | CHUANG, JONNIE | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013951 | /0656 | |
| Feb 27 2003 | LEE, YANN | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013951 | /0656 | |
| Apr 08 2003 | Harvatek Corporation | (assignment on the face of the patent) | / |
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