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The ornamental design for a light emitting diode package, as shown and described.
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A light emitting diode (LED) with two top electrodes is mounted on a first metal plate. One of the electrodes is wire-bonded to the first metal plate serving as one terminal of the LED. The other electrode of the LED is connected by wire-bonding to a second metal plate serving as a second terminal of the LED. The inner ends of the metal plates and the LED are imbedded in a transparent glue, leaving the outer ends of the metal plates for external connection. The transparent glue allows the light emitted from the LED to be radiated.
FIG. 1 is a top plan view of the light emitting diode package showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a right side elevation view thereof; and,
FIG. 5 is a side elevation view thereof.
Wang, Bily, Chuang, Jonnie, Lee, Yann
Patent | Priority | Assignee | Title |
D562272, | Nov 17 2006 | Lighthouse Technology Co., Ltd. | Light emitting diode (LED) |
Patent | Priority | Assignee | Title |
5969416, | Sep 19 1997 | Samsung Aerospace Industries, Ltd. | Ball grid array semiconductor package |
6268652, | Sep 26 1997 | NEC Electronics Corporation | CSP type semiconductor device with reduced package size |
6495861, | Mar 18 1999 | Ròhm Co., Ltd. | Light-emitting semiconductor chip |
6717256, | Aug 31 1998 | Rohm Co., Ltd. | Mounting structure for semiconductor device having entirely flat leads |
6777719, | Mar 19 1999 | Rohm Co., Ltd. | Chip light-emitting device |
20040075100, | |||
20040188697, | |||
D476961, | Apr 12 2002 | CITIZEN ELECTRONICS CO , LTD | Light-emitting diode |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 27 2003 | WANG, BILY | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013951 | /0656 | |
Feb 27 2003 | CHUANG, JONNIE | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013951 | /0656 | |
Feb 27 2003 | LEE, YANN | HARVATEK CORP | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013951 | /0656 | |
Apr 08 2003 | Harvatek Corporation | (assignment on the face of the patent) | / |
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