|
The ornamental design for a power converter, as shown and described.
|
FIG. 1 is a perspective view of a power converter, showing my design.
FIG. 2 is a front elevational view thereof.
FIG. 3 is a rear elevational view thereof.
FIG. 4 is a right side elevational view thereof.
FIG. 5 is a left side elevational view thereof.
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Vinciarelli, Patrizio, LaFleur, Michael B., Finnemore, Fred M., McCauley, Charles I., Keay, Gary C., Nowak, Scott W., Thompson, Basil
Patent | Priority | Assignee | Title |
D524245, | Dec 15 2003 | Genlyte Thomas Group LLC | Dimmer module |
D558140, | Oct 26 2006 | Sony Corporation | Battery |
D606017, | Aug 21 2006 | Siemens Aktiengesellschaft | Convection cooled frequency converter |
D608735, | Jul 14 2009 | Daikin Industries Ltd. | Converter |
D641696, | Aug 21 2006 | Siemens Aktiengesellschaft | Convection cooled frequency converter |
D641697, | Aug 21 2006 | Siemens Aktiengesellschaft | Convection cooled frequency converter |
D692827, | May 23 2013 | Delta Electronics, Inc. | Power supply |
D799426, | Feb 08 2016 | Group Dekko, Inc. | Desktop receptacle cover |
D799427, | Feb 18 2016 | Group Dekko, Inc. | Desktop receptacle cover |
Patent | Priority | Assignee | Title |
2917678, | |||
3205408, | |||
3237079, | |||
3617615, | |||
3621338, | |||
3683241, | |||
4138711, | Sep 29 1977 | Allen-Bradley Company | Static control device for printed circuit package |
4400762, | Aug 25 1980 | Allen-Bradley Company | Edge termination for an electrical circuit device |
4417296, | Jul 23 1979 | Lockheed Martin Corporation | Method of connecting surface mounted packages to a circuit board and the resulting connector |
4479686, | Nov 24 1981 | Sony Corporation; Hosiden Electronics Co. Ltd. | Connector |
4531145, | Aug 04 1980 | WITEC CAYMAN PATENTS, LTD | Method of fabricating complex micro-circuit boards and substrates and substrate |
4551746, | Oct 05 1982 | Mayo Foundation for Medical Education and Research | Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
4551747, | Oct 05 1982 | Mayo Foundation for Medical Education and Research | Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation |
4603927, | Jul 12 1984 | Rogers Corporation | Surface mounted bussing device |
4603929, | Feb 13 1985 | Nortel Networks Limited | Connector shroud |
4622621, | Dec 11 1984 | Thomson-CSF | Chip carrier for high frequency power components cooled by water circulation |
4685753, | Jul 05 1983 | Sumitomo Wiring Systems, Ltd | Interconnection apparatus for wiring harnesses |
4724283, | Sep 27 1985 | NEC Corporation | Multi-layer circuit board having a large heat dissipation |
4740414, | Nov 17 1986 | Boeing Company, the | Ceramic/organic multilayer interconnection board |
4741472, | Jul 27 1985 | Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig | Method of soldering an integrated circuit and printed circuit board |
4750089, | Nov 22 1985 | Texas Instruments Incorporated; TEXAS INSTRUMENTS INCORPORATED, 13500 NORTH CENTRAL EXPRESSWAY, DALLAS, TEXAS, 75265, A CORP OF DELAWARE | Circuit board with a chip carrier and mounting structure connected to the chip carrier |
4769525, | Sep 02 1986 | Hughes Aircraft Company | Circuit package attachment apparatus and method |
4783695, | Sep 26 1986 | Lockheed Martin Corporation | Multichip integrated circuit packaging configuration and method |
4783697, | Jan 07 1985 | Motorola, Inc. | Leadless chip carrier for RF power transistors or the like |
4847136, | Mar 21 1988 | HE HOLDINGS, INC , A DELAWARE CORP ; Raytheon Company | Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier |
4879630, | Sep 03 1987 | Bendix Electronics S.A. | Housing for an electronic circuit |
4918811, | Sep 26 1986 | Lockheed Martin Corporation | Multichip integrated circuit packaging method |
4953005, | Apr 17 1987 | XOC DEVICES, INC | Packaging system for stacking integrated circuits |
4959750, | Jun 25 1987 | WABCO WESTINGHOUSE FAHRZEUGBREMSEN GMBH, HANNOVER, GERMANY | Printed circuit board for carrying a mixed-component assembly |
4975824, | Dec 11 1989 | Sundstrand Corporation | Power converter circuit board |
4994215, | Aug 04 1980 | WITEC CAYMAN PATENTS, LTD | Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits |
5006673, | Dec 07 1989 | Freescale Semiconductor, Inc | Fabrication of pad array carriers from a universal interconnect structure |
5019941, | Nov 03 1989 | Motorola, Inc. | Electronic assembly having enhanced heat dissipating capabilities |
5019946, | Sep 27 1988 | Lockheed Martin Corporation | High density interconnect with high volumetric efficiency |
5028987, | Jul 03 1989 | Silicon Power Corporation | High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip |
5184281, | Mar 03 1992 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Heat dissipation apparatus |
5200884, | Feb 15 1989 | Nihon Kaiheiki Kogyo Kabushiki Kaisha | Electrical control device |
5249971, | Sep 13 1991 | HON HAI PRECISION INDUSTRY CO , LTD | IC package connector |
5352851, | Sep 08 1992 | Texas Instruments Incorporated | Edge-mounted, surface-mount integrated circuit device |
5365403, | Jul 17 1992 | VLT, INC | Packaging electrical components |
5394300, | Sep 04 1992 | Mitsubishi Denki Kabushiki Kaisha | Thin multilayered IC memory card |
5742478, | Sep 25 1996 | Radiating structure of a power converter | |
5909358, | Nov 26 1997 | DISTRIBUTED POWER, INC | Snap-lock heat sink clip |
6000125, | Jan 30 1996 | SAMSUNG ELECTRONICS CO , LTD | Method of heat dissipation from two surfaces of a microprocessor |
6031726, | Nov 06 1995 | VLT, INC | Low profile mounting of power converters with the converter body in an aperture |
6623281, | Jun 29 1999 | Vicor Corporation | Mounting electronic components on circuit boards |
20020016094, | |||
202349, | |||
D263465, | Oct 11 1979 | FRANZUS COMPANY, INC , A CORP OF DE | Voltage converter or similar article |
D297928, | Feb 26 1985 | VLT CORPORATION, ONE RIVERWALK PLACE, 700 NORTH ST MARY S SAN ANTONIO, TEXAS 78205, A TX CORP | DC to DC power converter |
D344928, | Dec 17 1991 | VLT, INC | Package for DC-DC power converter or related circuitry |
D349682, | Apr 08 1993 | PWER BRIDGE, LLC | Power converter casing |
D350529, | Oct 15 1992 | PWER BRIDGE, LLC | Power converter casing |
D363056, | Dec 17 1991 | VLT, INC | Package for DC-DC power converter or related circuitry |
D365082, | Sep 15 1993 | Progressive Dynamics, Inc. | Electrical power converter |
D371110, | Feb 15 1995 | Natel Engineering Company, Inc. | Power converter |
D379174, | Feb 20 1996 | POWERTEC INDUSTRIAL MOTORS, INC | Motor control housing |
D386761, | Mar 31 1995 | Mitek Corporation | Audio amplifier |
D427146, | Jun 07 1999 | Power inverter | |
D427147, | Jun 07 1999 | Power inverter | |
D427969, | Jun 07 1999 | Power inverter | |
EP141582, | |||
EP674474, | |||
EP772379, | |||
GB2214731, | |||
JP173966, | |||
JP2129766, | |||
JP2142173, | |||
JP2151095, | |||
JP3163893, | |||
JP329389, | |||
JP433278, | |||
JP5048579, | |||
JP5315192, | |||
JP63146940, | |||
JP6509686, | |||
JP7143747, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 13 2000 | VLT Corporation | VLT, INC | MERGER SEE DOCUMENT FOR DETAILS | 014763 | /0124 | |
Nov 01 2001 | VLT, Inc. | (assignment on the face of the patent) | / | |||
Jan 28 2002 | THOMPSON, BASIL | VLT Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012648 | /0584 | |
Jan 28 2002 | NOWAK, SCOTT W | VLT Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012648 | /0584 | |
Jan 28 2002 | KEAY, GARY C | VLT Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012648 | /0584 | |
Jan 28 2002 | MCCAULEY, CHARLES I | VLT Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012648 | /0584 | |
Jan 28 2002 | LAFLEUR, MICHAEL B | VLT Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012648 | /0584 | |
Jan 28 2002 | FINNEMORE, FRED M | VLT Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012648 | /0584 | |
Jan 28 2002 | VINCIARELLI, PATRIZIO | VLT Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012648 | /0584 | |
Aug 10 2004 | NOWAK, SCOTT W | VLT, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015398 | /0030 | |
Aug 10 2004 | KEAY, GARY C | VLT, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015398 | /0030 | |
Aug 19 2004 | LAFLEUR, MICHAEL B | VLT, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015398 | /0030 | |
Aug 19 2004 | VINCIARELLI, PATRIZIO | VLT, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015398 | /0030 | |
Aug 24 2004 | MCCAULEY, CHARLES I | VLT, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015398 | /0030 | |
Aug 26 2004 | FINNEMORE, FRED M | VLT, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015398 | /0030 | |
Sep 30 2004 | THOMPSON, BASIL | VLT, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015398 | /0030 | |
Jul 27 2020 | VLT, INC | Vicor Corporation | MERGER AND CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 053868 | /0920 | |
Jul 27 2020 | Vicor Corporation | Vicor Corporation | MERGER AND CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 053868 | /0920 |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |