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The ornamental design for an electronic device suspending structure assembly, as shown and described.
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FIG. 1 is a perspective view of an electronic device suspending structure assembly of our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Chung, Cheng Kuang, Wen, Shin-Hua
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 11 2003 | CHUNG, CHENG KUANG | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014991 | /0446 | |
Nov 11 2003 | WEN, SHIN-HUA | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014991 | /0446 | |
Feb 12 2004 | Hon Hai Precision Ind. Co., Ltd. | (assignment on the face of the patent) | / | |||
Aug 26 2019 | HON HAI PRECISION INDUSTRY CO , LTD | INGRASYS TECHNOLOGY INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 050305 | /0251 |
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