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The ornamental design for a heat dissipating fan, as shown.
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FIG. 1 is a perspective view of a heat dissipating fan, in accordance with the present invention;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Li, Nien-Lun, Yeh, Yun-Yeu, Lee, Hzen-Hsing, Hung, Yi-Peng
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 11 2003 | LI, NIEN-LUN | DATECH TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014441 | /0787 | |
Aug 11 2003 | YEH, YUN-YEU | DATECH TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014441 | /0787 | |
Aug 11 2003 | LEE, HZEN-HSING | DATECH TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014441 | /0787 | |
Aug 11 2003 | HUNG, YI-PENG | DATECH TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014441 | /0787 | |
Aug 28 2003 | Datech Technology Co., Ltd. | (assignment on the face of the patent) | / |
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