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The ornamental design for a housing for electronic device, as shown.
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FIG. 1 is a top plan view of the housing.
FIG. 2 is a front elevation view of the housing.
FIG. 3 is a bottom plan view of the housing.
FIG. 4 is a rear elevation view of the housing.
FIG. 5 is a side elevation view of the housing.
FIG. 6 is an opposing side elevation view of the housing.
FIG. 7 is a first perspective view of the housing.
FIG. 8 is top and rear perspective view of the housing; and,
FIG. 9 is a top and front perspective view of the housing.
Enns, Frederick, Roy, Luc, Jones, III, William R.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 08 2003 | Extreme Networks | (assignment on the face of the patent) | / | |||
Mar 30 2004 | ENNS, FREDERICK | Extreme Networks | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015186 | /0530 | |
Mar 30 2004 | ROY, LUC | Extreme Networks | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015186 | /0530 | |
Apr 02 2004 | JONES, III, WILLIAM R | Extreme Networks | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015186 | /0530 | |
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