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The ornamental design for a combined headphone and microphone, as shown.
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FIG. 1 is a perspective view of a combined headphone and microphone showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 18 2004 | MURAKAMI, TOMONARI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015958 | /0637 | |
Nov 03 2004 | Sony Corporation | (assignment on the face of the patent) | / |
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