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The ornamental design for a headphone, as shown and described.
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FIG. 1 is a front elevational view of a headphone showing our new design, wherein lines VI—VI and VI′—VI′ are shown;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side elevational view thereof,
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a partially enlarged view thereof, taken between the lines VII—VII and VII′—VII′ shown in FIG. 1;
FIG. 7 is a perspective view thereof;
FIG. 8 is a reference perspective view thereof, showing a using condition; and
FIG. 9 is a reference perspective view thereof, showing another using condition; and,
FIG. 10 is a reference right side elevational view thereof.
The broken lines showing of the environment are for illustrative purposes only and form no part of the claimed design.
Deguchi, Michio, Fukamatsu, Kanae, Hirakawa, Maki
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 10 2004 | Sony Computer Entertainment Inc. | (assignment on the face of the patent) | / | |||
Feb 01 2005 | HIRAKAWA, MAKI | Sony Computer Entertainment Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016244 | /0204 | |
Feb 01 2005 | DEGUCHI, MICHIO | Sony Computer Entertainment Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016244 | /0204 | |
Feb 01 2005 | FUKAMATSU, KANAE | Sony Computer Entertainment Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016244 | /0204 |
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