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The ornamental design for a computer mainframe front panel, as shown and described.
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FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof.
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a top, front and right side perspective view thereof, shown with the fronts in an open position.
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
D349108, | Sep 14 1992 | Computer front panel | |
D474186, | May 17 2002 | Sun Microsystems, Inc | Front panel for a computer enclosure |
D476992, | Apr 18 2002 | Hon Hai Precision Ind. Co., Ltd. | Computer front bezel |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 26 2004 | LIN, PEI-SHI | THERMALTAKE TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015003 | /0881 | |
Jul 30 2004 | Thermaltake Technology Co., Ltd. | (assignment on the face of the patent) | / |
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