Patent
   D514531
Priority
Jul 10 2002
Filed
Jan 03 2003
Issued
Feb 07 2006
Expiry
Feb 07 2020
Assg.orig
Entity
unknown
4
10
n/a
The ornamental design for an optical module, as shown and described.

FIG. 1 is a front, top and right side perspective view of a optical module, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical module, showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof; and,

FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.

The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.

Sakai, Kiyohide, Takagi, Shinichi, Aruga, Hiroshi

Patent Priority Assignee Title
8611094, Jul 08 2010 Mitsubishi Electric Corporation Optical module
D769230, Jan 22 2015 Samsung Electronics Co., Ltd. Optical repeater
D879767, May 30 2017 KOHOKU KOGYO CO., LTD. Optical communication module
D879768, May 30 2017 KOHOKU KOGYO CP., LTD. Optical communication module
Patent Priority Assignee Title
5089861, May 09 1990 Rohm Co., Ltd. Semiconductor laser device with mounting block
5252856, Sep 26 1990 Renesas Electronics Corporation Optical semiconductor device
6157012, Sep 07 1998 Nippon Sheet Glass Co., Ltd. Method of manufacturing an optical module using multiple applications of thermosetting resins and multiple heating processes
6181720, Jan 16 1997 Renesas Electronics Corporation Semiconductor laser device and method for manufacturing same
6750535, Apr 18 2002 Hon Hai Precision Ind. Co., Ltd. Package for enclosing a laser diode module
20020003705,
20040264888,
D483338, Jul 10 2002 Mitsubishi Denki Kabushiki Kaisha Optical module
D484105, Jul 10 2002 Mitsubishi Denki Kabushiki Kaisha Optical module
D494147, Jul 10 2002 Mitsubishi Denki Kabushiki Kaisha Optical module
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 03 2003Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
Feb 12 2003TAKAGI, SHINICHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138320129 pdf
Feb 12 2003ARUGA, HIROSHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138320129 pdf
Feb 12 2003SAKAI, KIYOHIDEMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138320129 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule