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The ornamental design for the light emitting diode, substantially as shown and described.
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FIG. 1 is a perspective view of the light emitting diode,
FIG. 2 is a front view thereof the rear view being a mirror image,
FIG. 3 is a plan view thereof,
FIG. 4 is a bottom view thereof,
FIG. 5 is a right side view, the left side view being a mirror image thereof; and,
FIG. 6 is a perspective view thereof as viewed from below.
This item is a light emitting diode, wherein a reflecting frame is provided on an upper surface of a circuit board, within which a plurality of light emitting elements are positioned, which are sealed from above by a light permeable resin. A heat-dissipating heat sink is provided on a lower surface of the circuit board to protrude from the lower surface.
Ishii, Hirohiko, Ishizaka, Mitsunori
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 09 2004 | ISHIZAKA, MITSUNORI | CITIZEN ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016273 | /0923 | |
Dec 09 2004 | ISHII, HIROHIKO | CITIZEN ELECTRONICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016273 | /0923 | |
Dec 23 2004 | Citizen Electronics Co., Ltd. | (assignment on the face of the patent) | / |
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