Patent
   D515620
Priority
Nov 02 2004
Filed
Mar 28 2005
Issued
Feb 21 2006
Expiry
Feb 21 2020
Assg.orig
Entity
unknown
2
10
n/a
The ornamental design for an ink pad assembly, as shown and described.

FIG. 1 is a top perspective view of an ink pad assembly showing my new design;

FIG. 2 is a top plan view thereof drawn on a slightly reduced scale;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a side elevation thereof; and,

FIG. 5 is another top perspective view thereof shown in a open condition.

Lien, Yun Dien

Patent Priority Assignee Title
D570384, Oct 22 2007 Substrate for manufacturing cutting elements
D834088, Jan 26 2017 Sun Same Enterprises Co., Ltd. Ink stamp
Patent Priority Assignee Title
4375191, Feb 02 1981 DICKEY, INC One-piece, all-plastic reproducing stamp and trough holding unit
5505130, Jun 10 1994 CLEARSNAP HOLDING, INC Ink pad assemblies with interchangeable ink-impregnated pads
115959,
223056,
228157,
D372341, Aug 03 1994 REXAM COSMETIC PACKAGING INC Compact
D381038, Jun 06 1995 TSUKINEKO CO , LTD Combined stamp pad and container
D389509, May 19 1995 TSUKINEKO CO , LTD Combined stamp pad and support
D427624, Jul 02 1999 TSUKINEKO CO , LTD Stamp pad with an ink vessel
D482497, Oct 10 2002 Qualipac Make-up compact
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Mar 04 2005LIEN, YUN DIENYI YAO CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0164410866 pdf
Mar 28 2005Yi Yao Co., Ltd.(assignment on the face of the patent)
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