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The ornamental design for a housing for an electronic circuit module, as shown and described.
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The housing for an electronic circuit module is intended to be used to house electronic circuit board and their included electronic components and other electronic circuitry.
FIG. 1 is a right side perspective view of the housing for an electronic circuit module embodying our new design;
FIG. 2 is a left side elevational view thereof
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a top plan view thereof; and,
FIG. 5 is a bottom plan view thereof.
The broken line disclosures in the drawings are for illustrative purposes only and form no part of the claimed design.
Schneider, Eric A., Hahn, Amand J., Boer, Rod P.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 22 2005 | Honeywell International Inc. | (assignment on the face of the patent) | / |
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