|
The ornamental design for a modular electronic housing, as shown and described.
|
The Modular Electronic Housing Thereof includes modular electronic housings intended to be used to house electronic circuit board and their included electronic components. The modular housings can be assembled into groupings of electronic housings as illustrated.
FIG. 1 is a right side perspective view of a modular electronic housing showing our new design.
FIG. 2 is a left side elevational view thereof;
FIG. 3 is a top plan view thereof; and,
FIG. 4 is a bottom plan view thereof.
The broken line disclosures in the drawings are for illustrative purposes only and form no part of the claimed design.
Schneider, Eric A., Hahn, Amand J., Boer, Rod P.
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
5842514, | Mar 06 1997 | RPX CLEARINGHOUSE LLC | Electronic unit |
6625017, | Feb 12 2001 | Special Product Company | Telecommunications enclosure with individual, separated card holders |
6628521, | Nov 06 2000 | CommScope EMEA Limited; CommScope Technologies LLC | Mechanical housing |
6649830, | May 24 2002 | COMMSCOPE DSL SYSTEMS LLC | Housing for circuit cards |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 18 2003 | Honeywell International, Inc. | (assignment on the face of the patent) | / | |||
Apr 15 2004 | HAHN, AMAND J | Honeywell International, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015256 | /0182 | |
Apr 15 2004 | BOER, ROD P | Honeywell International, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015256 | /0182 | |
Apr 15 2004 | SCHNEIDER, ERIC A | Honeywell International, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015256 | /0182 |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |