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Patent
   D518452
Priority
Dec 18 2003
Filed
Jun 28 2005
Issued
Apr 04 2006
Expiry
Apr 04 2020
Inventors
Schneider,…
Assg.orig
Honeywell …
Assg.curr
Honeywell …
Entity
unknown
Referenced by
1
References
4
Maint.:
n/a
The ornamental design for a modular electronic housing and assemblies, as shown and described.

The modular electronic housing and assemblies comprise an assembly of modular electronic housings intended to be used to house electronic circuit boards and their included electronic components.

The FIGURE is a right side perspective view of a modular electronic housing and assemblies showing our new design.

The broken line disclosure in the drawings are for illustrative purposes only and form no part of the claimed design.
INVENTORS:

Schneider, Eric A., Hahn, Amand J., Boer, Rod P.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D825502, Oct 14 2016 KOKUSAI ELECTRIC CORPORATION Heater for substrate processing apparatus
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
5842514, Mar 06 1997 RPX CLEARINGHOUSE LLC Electronic unit
6625017, Feb 12 2001 Special Product Company Telecommunications enclosure with individual, separated card holders
6628521, Nov 06 2000 CommScope EMEA Limited; CommScope Technologies LLC Mechanical housing
6649830, May 24 2002 COMMSCOPE DSL SYSTEMS LLC Housing for circuit cards
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 28 2005Honeywell International Inc.(assignment on the face of the patent)
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