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The ornamental design for a linking device, as shown.
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FIG. 1 is a perspective view of a linking device showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 30 2004 | Sony Corporation | (assignment on the face of the patent) | / | |||
Feb 03 2005 | SHIMIZU, YOSUKE | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016318 | /0210 |
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