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Patent
D529874
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Priority
Jan 20 2006
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Filed
Jan 20 2006
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Issued
Oct 10 2006
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Expiry
Oct 10 2020
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Assg.orig
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Entity
unknown
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6
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12
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n/a
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The ornamental design for a power controller heat sink, as shown and described.
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FIG. 1 is a top perspective view of the power controller heat sink;
FIG. 2 is a bottom perspective view thereof; and,
FIG. 3 is a side view thereof.
The broken lines are included for the purpose of illustrating environmental structure and form no part of the claimed design.
Von Arx, Theodore T., Ness, Keith D.
| Patent |
Priority |
Assignee |
Title |
| 5305185, |
Sep 30 1992 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L P |
Coplanar heatsink and electronics assembly |
| 5844312, |
Oct 13 1995 |
Aavid Thermalloy, LLC |
Solderable transistor clip and heat sink |
| 6075703, |
Mar 26 1997 |
Samsung Electronics Co., Ltd. |
Heat sink assembly |
| 6079486, |
Feb 27 1997 |
Aavid Thermalloy, LLC |
Spring clip for attaching an electronic component to a heat sink and an assembly utilizing the same |
| 6470962, |
Aug 24 2001 |
Infortrend Technology Inc. |
Retaining tool of heat radiator |
| 6735084, |
Nov 01 2002 |
Samsung Electronics Co., Ltd. |
Heat sink for electronic devices, and circuit board and plasma display panel assembly each equipped with the heat sink |
| D315832, |
Oct 24 1988 |
WACHOVIA CAPITAL FINANCE CORPORATION CENTRAL |
Heat sink |
| D338449, |
Jul 25 1991 |
|
Exterior surface of a heat sink |
| D384040, |
Apr 19 1996 |
WAKEFIELD THERMAL SOLUTIONS, INC |
Heat sink |
| D399831, |
Apr 29 1997 |
OCZ TECHNOLOGY GROUP, INC |
Cooling device |
| D406112, |
Mar 20 1998 |
DSC Communications Corporation |
Heat sink |
| D450044, |
Jun 14 2000 |
|
Cooler for heat dissipation |
| Date |
Maintenance Fee Events |
n/a
| Date |
Maintenance Schedule |
n/a