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The ornamental design for a radio-frequency module for a communication device, as shown and described.
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FIG. 1 is a front elevation of an radio-frequency module for a communication device showing my new design;
FIG. 2 is a rear elevation thereof;
FIG. 3 is a right side elevation thereof the side opposite being a mirror image;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a bottom perspective view thereof.
The broken line showing of portions of the design is for illustrative purposes only and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 24 2005 | Taiyo Yuden Co., Ltd. | (assignment on the face of the patent) | / | |||
Jun 20 2005 | MARUYAMA, HIDEYUKI | TAIYO YUDEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016774 | /0996 |
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