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The ornamental design for a cpu heat sink packaging box, as shown and described.
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FIG. 1 is a top plan view of a CPU heat sink packaging box showing our new design, in disassembled condition;
FIG. 2 is a top plan view thereof, in assembled condition;
FIG. 3 is a side elevational view thereof;
FIG. 4 is a side elevational view thereof from the side opposite that shown in FIG. 3;
FIG. 5 is an end elevational view thereof; and,
FIG. 6 is an end elevational view thereof from the end opposite that shown in FIG. 5.
The black shading in the drawing is intended to represent the color black in the claimed design.
Xu, Yun-Dong, Liang, Chun-Chi, Liu, Ming-Fang
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 03 2004 | LIU, MING-FANG | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015956 | /0278 | |
Sep 03 2004 | LIANG, CHUN-CHI | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015956 | /0278 | |
Sep 03 2004 | XU, YUN-DONG | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015956 | /0278 | |
Oct 28 2004 | Hon Hai Precision Ind. Co., LTD | (assignment on the face of the patent) | / |
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