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The ornamental design for a computer motherboard packaging box, as shown and described.
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The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
FIG. 1 is a perspective view of a computer motherboard packaging box of our new design;
FIG. 2 is a side elevational view thereof;
FIG. 3 is a side elevational view thereof from the side opposite that shown in FIG. 2;
FIG. 4 is an end elevational view thereof;
FIG. 5 is an end elevational view thereof from the end opposite that shown in FIG. 4;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Xu, Yun-Dong, Liang, Chun-Chi, Chen, Jing-Qun
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 16 2004 | CHEN, JING-OUN | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015996 | /0966 | |
Aug 16 2004 | LIANG, CHUN-CHI | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015996 | /0966 | |
Aug 16 2004 | XU, YUN-DONG | HON HAI PRECISION IND CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015996 | /0966 | |
Nov 15 2004 | Hon Hai Precision Ind. Co., LTD | (assignment on the face of the patent) | / |
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