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I claim the ornamental design for a light emitting diode, as shown and described.
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FIG. 1 is a perspective view of a light emitting diode showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a front elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a rear plan view thereof; and,
FIG. 7 is a bottom elevation view thereof.
Patent | Priority | Assignee | Title |
D556703, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
D727558, | Jan 11 2013 | AERO IP HOLDINGS LLC | Optical lens |
Patent | Priority | Assignee | Title |
3855606, | |||
3914786, | |||
4152624, | Mar 16 1978 | SOLUTIA INC | Molded LED indicator |
4215361, | Sep 12 1978 | LASALLE BUSINESS CREDIT, INC | Winged self-fastened heat sinks for semiconductor devices |
4270138, | Mar 02 1979 | General Electric Company | Enhanced thermal transfer package for a semiconductor device |
4631805, | Mar 23 1981 | Motorola Inc. | Semiconductor device including plateless package fabrication method |
4827329, | Oct 05 1985 | Telefunken Electronic GmbH | Semiconductor array |
5266817, | May 18 1992 | Lite-On Technology Corporation | Package structure of multi-chip light emitting diode |
6476481, | May 05 1998 | Infineon Technologies Americas Corp | High current capacity semiconductor device package and lead frame with large area connection posts and modified outline |
6608334, | Dec 09 1999 | Rohm Co., Ltd. | Light-emitting chip device with case and method of manufacture thereof |
6670207, | Mar 15 1999 | EVERLIGHT ELECTRONICS CO , LTD | Radiation emitter device having an integral micro-groove lens |
6828170, | Mar 15 1999 | Gentex Corporation | Method of making a semiconductor radiation emitter package |
6924514, | Feb 19 2002 | Nichia Corporation | Light-emitting device and process for producing thereof |
6975023, | Sep 04 2002 | Infineon Technologies Americas Corp | Co-packaged control circuit, transistor and inverted diode |
D289037, | Dec 16 1983 | Sumitomo Electric Industries, Ltd. | Photodiode |
D432095, | Oct 09 1998 | Vishay Semiconductor GmbH | Light-emitting semi-conductor component |
D439351, | Nov 18 1999 | Sharp Kabushiki Kaisha | Light emitting diode |
D486801, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
D488137, | Jan 30 2002 | Nichia Corporation | Light emitting diode |
D491899, | May 22 2002 | Nichia Corporation | Light emitting diode |
D497884, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
D505120, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
D515045, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
D522469, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
D528079, | Sep 26 2002 | Nichia Corporation | Light emitting diode |
JP1046564, | |||
JP1146343, | |||
JP1146344, | |||
RE36614, | Jul 17 1998 | OSRAM OPTO SEMICONDUCTORS GMBH & CO OGH | Modular surface mount component for an electrical device or LED's |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 24 2002 | SUENAGA, RYOMA | Nichia Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018198 | 0402 | |
Aug 21 2006 | Nichia Corporation | (assignment on the face of the patent) |
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