|
The ornamental design for a light emitting diode module, as shown and described.
|
FIG. 1 is a perspective view of a light emitting diode module showing the new design.
FIG. 2 is a front view thereof.
FIG. 3 is a right side view thereof, and a rear view and a left side view being the same of the right side view.
FIG. 4 is a top plan view thereof.
FIG. 5 is a bottom plan view thereof.
FIG. 6 is an enlarged cross-sectional view taken along line 6—6 in FIG. 2, wherein the portions having the double slanted lines are transparent; and,
FIG. 7 is an enlarged cross-sectional view taken along line 7—7 in FIG. 4, wherein the portions having the double slanted lines are transparent.
Patent | Priority | Assignee | Title |
6355946, | Dec 16 1998 | Lucent Technologies Inc | Semiconductor device with reflector |
6495861, | Mar 18 1999 | Ròhm Co., Ltd. | Light-emitting semiconductor chip |
6593598, | Dec 17 1999 | Rohm Co., Ltd. | Chip-type light-emitting device with case |
6624491, | Jun 30 1998 | Osram GmbH | Diode housing |
D503930, | Sep 15 2003 | Nichia Corporation | Light emitting diode |
D517027, | Dec 05 2003 | Nichia Corporation | Light emitting diode |
D520965, | Jan 10 2003 | Citizen Electronics Co., Ltd. | Light emitting diode for illuminating an object |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 05 2005 | EGAWA, KAZUO | Toshiba Lighting & Technology Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016933 | /0924 | |
Aug 26 2005 | Toshiba Lighting & Technology Corporation | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |