Patent
   D553572
Priority
Oct 14 2004
Filed
Oct 14 2004
Issued
Oct 23 2007
Expiry
Oct 23 2021
Assg.orig
Entity
unknown
5
8
n/a
The ornamental design for a module assembly, as shown and described.

FIG. 1 is a top plan view of a module assembly, showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a side elevation view thereof;

FIG. 5 is a side elevation view of the opposite side shown in FIG. 4;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a top, front and side perspective view thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

Yi, George Youhzi, Lewis, William J., Chen, Hsi-sheng, Lin, Hung-Ting, Hsu, Kuang Hsin

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 27 2004CHEN, HSI-SHENGCisco Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0160740532 pdf
Oct 14 2004Cisco Technology, Inc.(assignment on the face of the patent)
Oct 15 2004LIN, HUNG-TINGCisco Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0160740532 pdf
Oct 15 2004HSU, KUANG HSINCisco Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0160740532 pdf
Oct 19 2004YI, GEORGE YOUHZICisco Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0160740532 pdf
Oct 19 2004LEWIS, WILLIAM JCisco Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0160740532 pdf
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