The ornamental design for a load-lock chamber, as shown and described.
The present article relates to a load-lock chamber for a multi-chamber type semiconductor substrate processing apparatus for a film forming process and other processes for semiconductor substrates, and others to be processed. The load-lock chamber is, as shown in a reference drawing illustrating a state of usage of the load-lock chamber, connected to a transfer-chamber wherein load-in and load-out of substrates to be processed are carried out without exposing the transfer-chamber to air.
FIG. 1 is a top view of the load-lock chamber,
FIG. 2 is a front elevational view thereof;
FIG. 3 is a back elevational view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a sectional view taken along line 7-7 in FIG. 1;
FIG. 8 is a perspective view thereof; and,
FIG. 9 is a reference figure showing a bottom perspective view thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.