Patent
   D559806
Priority
Aug 12 2005
Filed
Nov 14 2005
Issued
Jan 15 2008
Expiry
Jan 15 2022
Assg.orig
Entity
unknown
2
16
n/a
The ornamental design for a pair of stage arms for a semiconductor wafer delivery apparatus, as shown and described.

FIG. 1 is a top plan view of a pair of stage arms for a semiconductor wafer delivery apparatus showing our new design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a cross-sectional view thereof taken along line 44 in FIG. 1;

FIG. 5 is a cross-sectional view thereof taken along line 55 in FIG. 4; and,

FIG. 6 is a perspective view thereof in use.

The broken line showing represents unclaimed subject matter.

Hosaka, Hiroki

Patent Priority Assignee Title
D601978, Jan 09 2008 KONICA MINOLTA, INC Printed circuit board
D608824, Jan 09 2008 KONICA MINOLTA, INC Print head for an ink jet printer
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 14 2005Tokyo Electron Limited(assignment on the face of the patent)
Jan 18 2006HOSAKA, HIROKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0175360986 pdf
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