Patent
   D561710
Priority
Jan 03 2007
Filed
Jan 03 2007
Issued
Feb 12 2008
Expiry
Feb 12 2022
Assg.orig
Entity
unknown
2
7
n/a
The ornamental design for a heat sink, as shown and described.

FIG. 1 is a perspective view of a heat sink;

FIG. 2 is a front elevation thereof;

FIG. 3 is a rear elevation thereof;

FIG. 4 is a left side elevation thereof;

FIG. 5 is a right side elevation thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom view thereof.

Lin, Pei-Hsi

Patent Priority Assignee Title
D954005, Sep 12 2019 FURUKAWA ELECTRIC CO ; FURUKAWA ELECTRIC CO , LTD Heatsink
D971862, Dec 28 2018 FURUKAWA ELECTRIC CO , LTD Heatsink
Patent Priority Assignee Title
6289975, Aug 23 1999 Heat dissipating device
6883592, Nov 04 1998 ZALMAN TECH CO , LTD Heatsink for electronic component
20060028798,
20070131389,
D426195, Aug 23 1999 Heat sink
D426814, Jun 28 1999 Zalman Tech Co., Ltd. Radiator for heat generating components in electronic equipment
D458232, Sep 27 2000 Zalman Tech Co., Ltd.; ZALMAN TECH CO , LTD Radiator for heat generating components in electronic equipment
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 05 2006LIN, PEI-HSITHERMALTAKE TECHNOLOGY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0187010489 pdf
Jan 03 2007Thermaltake Technology Co., Ltd.(assignment on the face of the patent)
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