Patent
   D565026
Priority
Jul 21 2006
Filed
Jan 19 2007
Issued
Mar 25 2008
Expiry
Mar 25 2022
Assg.orig
Entity
unknown
9
12
n/a
The ornamental design for headset, as shown and described.

FIG. 1 is a three-dimensional top view of the headset in accordance with the invention;

FIG. 2 is a three-dimensional bottom view of the headset in accordance with the invention;

FIG. 3 is a three-dimensional front view of the headset in accordance with the invention;

FIG. 4 is an isometric view of the headset in accordance with the invention;

FIG. 5 is a three-dimensional right side view of the headset in accordance with the invention;

FIG. 6 is a three-dimensional left side view of the headset in accordance with the invention; and,

FIG. 7 is a three-dimensional back view of the headset in accordance with the invention.

Brennwald, Joerg

Patent Priority Assignee Title
D579442, Dec 17 2007 Samsung Electronics Co., Ltd. Bluetooth headset
D678857, Nov 08 2011 Harman International Industries, Incorporated Behind the neck wireless headset
D678858, Nov 08 2011 Harman International Industries, Incorporated Behind the neck wireless headset
D878326, Sep 19 2018 CREATIVE TECHNOLOGY LTD Audio device
D894154, Oct 18 2016 SAMSON TECHNOLOGIES CORP Head-worn microphone
D894868, Dec 19 2018 Bose Corporation Headphones
D895571, Dec 19 2018 Bose Corporation Headphones
D964316, Nov 26 2021 Bone conduction headphones
D980187, Oct 25 2021 Shenzhen Arington Technology Co., Ltd. Earphone
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 19 2007Sennheiser Electronic GmbH & Co. KG(assignment on the face of the patent)
Mar 05 2007BRENNWALD, JOERGSENNHEISER ELECTRONIC GMBH & CO KGASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0192090629 pdf
Feb 01 2022SENNHEISER ELECTRONIC GMBH & CO KGSENNHEISER CONSUMER AUDIO GMBHASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0589820052 pdf
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