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Patent
D566141
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Priority
Feb 23 2007
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Filed
Apr 25 2007
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Issued
Apr 08 2008
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Expiry
Apr 08 2022
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Assg.orig
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Entity
unknown
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5
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6
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n/a
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The ornamental design for an abrasive segment, as shown and described.
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FIG. 1 is a perspective view of the abrasive segment of the present invention;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Park, Rin-Soon
Patent |
Priority |
Assignee |
Title |
2907146, |
|
|
|
5607346, |
May 14 1993 |
|
Polishing tool component |
5782682, |
Jun 09 1995 |
EHWA Diamond Ind. Co. Ltd. |
Grinding wheel having abrasive tips |
6213856, |
Apr 25 1998 |
Samsung Electronics Co., Ltd. |
Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk |
6994614, |
Aug 27 2002 |
OAK HILL SECURITIES FUND, L P |
Metal-bonded grinding tool |
D494196, |
Nov 18 2002 |
Ehwa Diamond Industrial Co., Ltd. |
Pad for grinding stone |
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