Patent
   D568260
Priority
Apr 20 2006
Filed
Apr 20 2006
Issued
May 06 2008
Expiry
May 06 2022
Assg.orig
Entity
unknown
4
8
n/a
The ornamental design for a notebook computer heat sink, as shown and described.

FIG. 1 is a perspective view of a notebook computer heat sink;

FIG. 2 is a front view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Chen, Deng-Hsi

Patent Priority Assignee Title
D618691, Jun 10 2009 ZALMAN TECH CO , LTD Cooler for a notebook computer
D948519, Apr 23 2020 Shenzhen Guanyi Industrial Design Co., Ltd. Cooling panel
D951261, Jul 23 2020 Shenzhen Guanyi Industrial Design Co., Ltd. Heat sink
D977488, May 29 2021 Heat sink
Patent Priority Assignee Title
2434676,
5558155, Aug 06 1993 Mitsubishi Denki Kabushiki Kaisha Cooling apparatus and assembling method thereof
6340056, Apr 24 2001 Chaun-Choung Technology Corp. Flow channel type heat dissipating fin set
7163049, Aug 10 2004 FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD Cooling fin assembly
20060262507,
20070121291,
D264205, Sep 05 1979 Motorola, Inc. Heat sink or similar article
D496006, Aug 16 2002 DATECH TECHNOLOGY CO , LTD Heat sink
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 20 2006Lian-Li Industrial Co., Ltd.(assignment on the face of the patent)
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